Guofeng New Materials: The photoresist the company is developing is photosensitive polyimide (PSPI) photoresist, which is widely used in semiconductor packaging, etc.

Post date April 21, 2022 — 17:34 Post Lock

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Home » News » Guofeng New Materials: The photoresist the company is developing is photosensitive polyimide (PSPI) photoresist, which is widely used in semiconductor packaging, etc.